IC Bonding
Since most of our products have micro-chips inside, the IC bonding machines are essential for quality control and short production lead time.
Factory size: 4,000 square meters (43,000 square feet)
Number of total staff: 400
Month production capacity: 600,000 pieces
Number of engineers: 15
Production facility: automated assembly lines, engineering and design center, IC bonding, plastic injection, molding.